View APTC60AM24SCTG_4581943.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

APTC60AM24SCTG
Phase leg Series & SiC parallel diodes Super Junction MOSFET Power Module
NTC2 VBUS Q1
VDSS = 600V RDSon = 24m max @ Tj = 25C ID = 95A @ Tc = 25C
Application * Motor control * Switched Mode Power Supplies * Uninterruptible Power Supplies Features * * Ultra low RDSon Low Miller capacitance Ultra low gate charge Avalanche energy rated
G1 OUT S1 Q2
G2
Parallel SiC Schottky Diode - Zero reverse recovery - Zero forward recovery - Temperature Independent switching behavior - Positive temperature coefficient on VF Kelvin source for easy drive Very low stray inductance - Symmetrical design - Lead frames for power connections Internal thermistor for temperature monitoring High level of integration
0/VBU S S2 NTC1
* * * *
OUT VBUS OUT
0/VBUS
S1 G1
S2 G2
NTC2 NTC1
Absolute maximum ratings
Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS Parameter Drain - Source Breakdown Voltage Continuous Drain Current
Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * RoHS Compliant Max ratings 600 95 70 260 20 24 462 15 3 1900 Unit V A V m W A mJ
August, 2009 1-7 APTC60AM24SCTG - Rev 0
Tc = 25C Tc = 80C
Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy
Tc = 25C
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
APTC60AM24SCTG
All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics
Symbol Characteristic IDSS RDS(on) VGS(th) IGSS Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current Test Conditions
VGS = 0V,VDS = 600V VGS = 0V,VDS = 600V
Min Tj = 25C Tj = 125C 2.1
Typ
VGS = 10V, ID = 47.5A VGS = VDS, ID = 5mA VGS = 20 V, VDS = 0V
3
Max 350 600 24 3.9 200
Unit A m V nA
Dynamic Characteristics
Symbol Characteristic Ciss Input Capacitance Coss Output Capacitance Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGS = 0V ; VDS = 25V f = 1MHz VGS = 10V VBus = 300V ID = 95A Inductive Switching (125C) VGS = 10V VBus = 400V ID = 95A RG = 2.5 Inductive switching @ 25C VGS = 10V ; VBus = 400V ID = 95A ; RG = 2.5 Inductive switching @ 125C VGS = 10V ; VBus = 400V ID = 95A ; RG = 2.5 Min Typ 14.4 17 300 68 102 21 30 100 45 810 1040 1320 1270 J ns nC Max Unit nF
J
Series diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage IF = 90A IF = 180A IF = 90A IF = 90A VR = 133V di/dt = 600A/s Test Conditions VR=200V Tj = 25C Tj = 125C Tc = 85C Min 200 Typ Max 500 750 90 1.1 1.4 0.9 24 48 99 450 1.15 V Unit V A A
Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C
Qrr
Reverse Recovery Charge
nC
www.microsemi.com
2-7
APTC60AM24SCTG - Rev 0
August, 2009
trr
Reverse Recovery Time
ns
APTC60AM24SCTG
SiC parallel diode ratings and characteristics
Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF QC C Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Total Capacitive Charge Total Capacitance IF = 40A Test Conditions VR=600V Tj = 25C Tj = 175C Tc = 100C Tj = 25C Tj = 175C Min 600 Typ 200 400 40 1.6 2.0 56 260 200 Max 800 4000 1.8 2.4 Unit V A A V nC pF
IF = 40A, VR = 300V di/dt =1200A/s f = 1MHz, VR = 200V f = 1MHz, VR = 400V
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Transistor Series diode 4000 -40 -40 -40 2.5 Min Typ Max 0.27 0.45 0.8 150 125 100 4.7 160 Unit
C/W
SiC Parallel diode RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
V C N.m g
Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight
To Heatsink
M5
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol R25 R25/R25 B25/85 B/B Characteristic Resistance @ 25C T25 = 298.15 K TC=100C
RT = R25 1 1 RT: Thermistor value at T exp B25 / 85 T - T 25
T: Thermistor temperature
Min
Typ 50 5 3952 4
Max
Unit k % K %
www.microsemi.com
3-7
APTC60AM24SCTG - Rev 0
August, 2009
APTC60AM24SCTG
SP4 Package outline (dimensions in mm)
ALL DIMENSIONS MARKED " * " ARE TOLERENCED AS :
See application note APT0501 - Mounting Instructions for SP4 Power Modules on www.microsemi.com
Typical CoolMOS Performance Curve
0.3 Thermal Impedance (C/W) 0.25 0.2 0.15 0.1 0.05 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 Single Pulse 0.001 0.01 0.1 1 10
0 0.00001
rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics 720 640 ID, Drain Current (A) 560 480 400 320 240 160 80 0 0 5 10 15 20 VDS, Drain to Source Voltage (V) RDS(on) vs Drain Current ID, DC Drain Current (A)
Normalized to VGS=10V @ 95A VGS=10V 5V 4.5V 4V
Transfert Characteristics 280 ID, Drain Current (A) 240 200 160 120 80 40 0 25 0 1 2 3 4 5 6 VGS, Gate to Source Voltage (V) 7
TJ=125C TJ=25C VDS > ID(on)xRDS(on)MAX 250s pulse test @ < 0.5 duty cycle
VGS=15&10V
6.5V 6V 5.5V
RDS(on) Drain to Source ON Resistance
1.3 1.25 1.2 1.15 1.1 1.05 1 0.95 0.9 0
80 60 40 20 0
VGS=20V
40
80
120 160 200 240 280
25
ID, Drain Current (A)
50 75 100 125 TC, Case Temperature (C)
150
www.microsemi.com
4-7
APTC60AM24SCTG - Rev 0
August, 2009
DC Drain Current vs Case Temperature 100
APTC60AM24SCTG
RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.2 1.1 1.0 0.9 0.8 25 50 75 100 125 150 TJ, Junction Temperature (C) Threshold Voltage vs Temperature 1.1 VGS(TH), Threshold Voltage (Normalized) 1.0 0.9 0.8 0.7 0.6 25 50 75 100 125 150 TC, Case Temperature (C) Capacitance vs Drain to Source Voltage 1000000 C, Capacitance (pF) 100000 10000 1000 100 10 0 10 20 30 40 50 VDS, Drain to Source Voltage (V) Crss Coss Ciss 1000 ID, Drain Current (A) ON resistance vs Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 25 50 75 100 125 150 TJ, Junction Temperature (C)
Maximum Safe Operating Area
VGS=10V ID= 95A
100
limited by RDSon
100 s
10
Single pulse TJ=150C TC=25C
1 ms 10 ms
1 1 10 100 1000 VDS, Drain to Source Voltage (V) Gate Charge vs Gate to Source Voltage VGS, Gate to Source Voltage (V) 12 10 8 6 4 2 0 0 40 80 120 160 200 240 280 320 Gate Charge (nC)
VDS=480V
ID=95A TJ=25C
VDS=120V VDS=300V
www.microsemi.com
5-7
APTC60AM24SCTG - Rev 0
August, 2009
APTC60AM24SCTG
140 120
td(on) and td(off) (ns) Delay Times vs Current 70 60
td(off) VDS=400V RG=2.5 TJ=125C L=100H td(on) VDS=400V RG=2.5 TJ=125C L=100H
Rise and Fall times vs Current
100 80 60 40 20 0 0
tr and tf (ns)
50 40 30 20 10 0
tf
tr
20 40 60 80 100 120 140 160
ID, Drain Current (A) Switching Energy vs Current
0
20
40
60
80 100 120 140 160
ID, Drain Current (A) Switching Energy vs Gate Resistance 5 Switching Energy (mJ)
VDS=400V ID=95A TJ=125C L=100H
3 Switching Energy (mJ) 2.5 2 1.5 1 0.5 0 0
VDS=400V RG=2.5 TJ=125C L=100H
Eoff
4 3 2 1 0
Eoff
Eon
Eon
20
40 60 80 100 120 140 160 ID, Drain Current (A)
0
5
10
15
20
25
Gate Resistance (Ohms) Source to Drain Diode Forward Voltage 1000
TJ=150C
Operating Frequency vs Drain Current
ZCS
250 Frequency (kHz) 200 150 100 50 0 10 20
ZVS
VDS=400V D=50% RG=2.5 TJ=125C TC=75C
IDR, Reverse Drain Current (A)
300
100
TJ=25C
hard switching
10
30
40
50
60
70
80
90
1 0.3 0.5 0.7 0.9 1.1 1.3 1.5
August, 2009 6-7 APTC60AM24SCTG - Rev 0
ID, Drain Current (A)
VSD, Source to Drain Voltage (V)
www.microsemi.com
APTC60AM24SCTG
Typical SiC parallel Diode Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.9 Thermal Impedance (C/W) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1
0.7 0.5 0.3 0.1 0.05 Single Pulse 0.9
0 0.00001
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds) Forward Characteristics
TJ=25C
Reverse Characteristics 800 IR Reverse Current (A) 700 600 500 400 300 200 100 0 200 300 400 500 600 700 800
TJ=25C TJ=125C TJ=75C TJ=175C
80
IF Forward Current (A)
60 40 20 0 0 0.5
TJ=75C
TJ=175C TJ=125C
1
1.5
2
2.5
3
3.5
VF Forward Voltage (V) Capacitance vs.Reverse Voltage
VR Reverse Voltage (V)
1600 1400 C, Capacitance (pF) 1200 1000 800 600 400 200 0 1 10 100 VR Reverse Voltage 1000
August, 2009 7-7 APTC60AM24SCTG - Rev 0
"COOLMOSTM comprise a new family of transistors developed by Infineon Technologies AG. "COOLMOS" is a trademark of Infineon Technologies AG". Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com

▲Up To Search▲

Price & Availability of APTC60AM24SCTG

	To Download APTC60AM24SCTG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .